The frequent leaks of the Xiaomi Mi 7 have left no doubts in our mind that phone will come in a double-sided glass version, and a ceramic version. According to the latest news, due to delays in the development of their under-display fingerprint scanning technology, they will be using the 3D facial recognition technology for unlocking instead.
Lei Jun, Xiaomi‘s CEO mentioned during his interaction with netizens on Weibo that Mi 7 may be equipped with under-display fingerprint technology and he also confirmed on the notch design. Recently, a number of medias have reported on the progress of Mi 7, stating that due to problems with the rate and speed of Qualcomm’s facial recognition feature discovered by Qualcomm’s internal testings, Mi 7 will be using 3D facial recognition instead.
According to sources, there are only three suppliers who can provide mature 3D sensing module solutions in the market: Qualcomm, Himax, and Truly Opto-electronics. Since Mi 7 uses the Snapdragon 845 mobile platform with 8GB storage, it is most likely to adopt Qualcomm’s 3D sensing module, as well as their wireless quickcharge technology.
Insiders say that we need to wait until the third quarter for the Android sensing module supporting 3D facial recognition to come out. If Mi 7 is releasing in the second quarter, then the fingerprint identification and 3D facial recognition will not be included. Mi 7 is expected to be released at the end of Q2 in June, thus we will have to wait and see.