Red Magic announced its new gaming flagships – the Red Magic 7S and 7S Pro – in its home country China on July 11.
Recently, ByteDance released a number of postings for internships on its school recruitment website in the area of SoC system development/design & verification. The positions will be mainly located in Beijing and Shanghai.
Fabless semiconductor company MediaTek announced on Monday the launch of the Dimensity 1050, its first mobile platform supporting mmWave 5G.
According to a Wednesday post by Chinese blogger “Digital Chat Station,” the new Qualcomm SM8475 chip is continuing the practice of previous years and is to be named the “Snapdragon 8 Gen1 Plus.”
Huawei's latest Nova 10 smartphone series is expected to adopt Qualcomm Snapdragon 778G and Snapdragon 7 Gen 1 chips and is to be released in June.
Chinese smartphone brand vivo unveiled the V1+ on Wednesday, the second chip the company designed and manufactured on its own. The first model to be equipped with the new chip will be the X80 series.
Chinese consumer electronics giant Xiaomi indicated on Wednesday that the Civi 1S is equipped with a Qualcomm Snapdragon 778G Plus chipset.
VastaiTech, a high-end chip design unicorn, announced on Monday that its B1 and B2 rounds of financing have been completed, totaling 1.6 billion yuan ($251 million).
OPPO announced on Wednesday that its first self-developed chip will be revealed during the company's INNO Day. The chip will be an independent NPU (Neural Processor) based on TSMC’s 6nm manufacturing process.
A blogger with the username "Magic Technology Jun" posted on Monday that Huawei is developing a processor chip called “Pangu,“ which will be used in PC computers.
Chinese budget smartphone brand Honor has announced that its upcoming Honor 50 series will be the first phone to be powered by Qualcomm's new Snapdragon 778G 5G chipset.
Xiaomi's CEO Lei Jun: the company has not given up on its self-developed Surge chipsets.
The 6th World Internet Conference kicked off on Sunday, October 20, in the river town of Wuzhen in east China’s Zhejiang Province.
Recently, Huawei's chip company HiSilicon (Shanghai) Technology Co., Ltd. announced it will sell its 4G communication IoT chip - the Huawei Hisilicon LTE Cat4 platform Balong 711 for the first time.
At the ARM China Media Communication Conference on September 25, ARM Holdings clarified that their cooperation with Huawei and HiSilicon will not be affected by the current US sanctions against Huawei.
Apart from the Kirin 985 on Huawei Mate 30 series, Huawei might release the world's first 5G chip that integrates application processors (AP) and baseband radio processors (BP).
On the morning of May 21, Ren Zhengfei, CEO of Huawei, gave an exclusive interview to CCTV at the Huawei headquarters in Shenzhen, during which he articulated his opinion on Huawei's ongoing conflicts with the U.S. and opened up about issues related to the future of 5G and even his family.
Amidst the recent undesirable turn of events, Huawei is keeping its head above water throughout the race for 5G.