On August 26, Weibo tipster “Wangzai Baishitong” issued a post claiming that the Magic V2 foldable smartphone and the Magic 5 Pro will both come with Snapdragon 8 Gen 2 chips. The Magic V2 foldable smartphone will be released first, and is expected to be unveiled before the end of the year.
According to the schedule of Snapdragon Tech Summit, the Snapdragon 8 Gen 2 chip is expected to be released in November this year. The chip is manufactured with TSMC 4nm process technology, with model number “SM8550.” It features a new “1+2+2+3” octa-core architecture design, with at least a 15% increase in performance over the Snapdragon 8+.
According to previous information, the Honor Magic V2 foldable smartphone and Magic UI 7.0 will be released in December this year. George Zhao, the CEO of Honor, previously said that Honor would bring about more cross-device interconnection and full scenario functions in the next Magic UI 7.
Honor’s new foldable smartphone will adopt a large battery design. The new device will adopt a dual-battery cell charging scheme. The capacity of the two batteries is 2030mAh and 2870mAh respectively, and the typical value will reach 5000mAh, and it will be the largest foldable smartphone this year.
For reference, Honor released the Honor Magic V foldable smartphone on January 10 this year. The new phone features a 7.9-inch OLED folding screen, a built-in 4750mAh battery and support for 66W wired super-fast charging.
Honor Magic V is a flagship product with a 6.45-inch OLED screen and an aspect ratio of 21.3:9. The resolution is 2560 x 1080 with a pixel density of 431 PPI and a screen-to-body ratio of 90%. It supports a maximum 120Hz refresh rate and a global maximum brightness of 1000 nits. By unfolding, Honor Magic V has an efficient flat panel experience of 7.9 wide field of view. The aspect ratio is 10.3:9, the resolution is 2272 x 1984, and the pixel density reaches 381 PPI. It provides support for a maximum refresh rate of 90Hz and a global maximum brightness of 800 nits.