Fabless semiconductor company MediaTek announced on Monday the launch of the Dimensity 1050, its first mobile platform supporting mmWave 5G.
The Dimensity 1050 adopts the TSMC 6nm process, is equipped with an octa-core CPU, and includes two Arm Cortex-A78 cores with main frequency of 2.5 GHz. Its GPU adopts a new generation Arm Mali-G610 graphics engine, supporting seamless connectivity through an easy switch between the Sub-6GHz and the mmWave standards. The chipset also supports dual 5G sim (5G SA + 5G SA) and dual sim VoNR calls, equipped with AI processor APU 550, and supports Wi-Fi 6E 2×2 MIMO. Products equipped with the Dimensity 1050 SoC are expected to be unveiled in the third quarter of this year.
In addition, MediaTek released two other mobile platforms, including the Dimensity 930 5G mobile platform supporting full-band Sub-6GHz 5G network and the Helio G99 4G mobile platform supporting 4G LTE network.
The Dimensity 930 5G mobile platform supports full-band Sub-6GHz 5G network, 2CC-CA and mixed duplex FDD+TDD, MiraVision HDR video playback and display for 120Hz Full HD+ displays and HDR10+ video. HyperEngine 3.0 Lite gaming enhancements bring multi-network management to ensure lower latency for a smooth user experience and maximized battery life.
Products equipped with the Dimensity 930 5G mobile platform are expected to be launched in the second quarter of 2022, while those adopting the Dimensity 1050 5G chipset and the Helio G99 4G chipset are expected to be released in the third quarter of this year.
According to CINNO research, MediaTek currently ranks top in terms of market share for smartphones chips in China. Its semiconductors are widely adopted in the products of various major smartphones manufacturers, including Huawei, Honor, Xiaomi, OPPO and vivo.