MediaTek Launches Dimensity 8000 5G Chip Series for Premium Smartphones
MediaTek launched its newest system-on-chips (SoCs) on Tuesday to bring flagship level technology to premium 5G smartphones. The lineup includes the Dimensity 8100 and Dimensity 8000. Smartphones powered by these chips will be available in the market starting from the first quarter of 2022.
William Lu, president of Xiaomi in China and general manager of Redmi, announced that the Redmi K50 series will be equipped with the Dimensity 8100 while realme, OnePlus and OPPO also said they would incorporate the new chipset. Among them, OPPO announced that the Dimensity 8000 series chip will be applied to its K10 series.
As a brand, Dimensity was born in 2019, and soon grew into four different series: Dimensity 1000, Dimensity 900, Dimensity 800 and Dimensity 700. The range of chipsets gave MideaTek the ability to offer chipsets to the high, middle and low-end markets. In the third quarter of 2020, its shipment volume was 45 million units, and the total shipment volume of 4G and 5G chips ranked first in the world.
In 2021, the Dimensity 9000 series was born and MediaTek move into first place for 4G and 5G shipments in the world for six consecutive quarters.
SEE ALSO: MediaTek Officially Launches Dimensity 9000 Flagship Chip, Announces Adoption by Global Device Makers
The Dimensity 8100 features four Arm Cortex-A78 cores, four Arm Cortex-A55 cores, and MediaTek’s own 5th Gen APU 580. The octa-core CPU is paired with Mali-G610.
In the MOBA and PUBG game test, the power consumption of Dimensity 8100 and temperature is lower than that of competing products. For sandbox-style games that need higher performance, Dimensity 8100 can also maintain stable frame rates.
Both chips combine an Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies which can intelligently control power consumption, reduce network delay, and leave more room for manufacturers and users to set up according to specific needs.
Through its proprietary protocol track, the Bluetooth LE Audio with Dual-Link True Wireless Stereo and smart antenna 2.0, MediaTek ensures that the network delays while gaming is less than 100 milliseconds.
For imaging, both chips make use of the Imagiq 780 ISP which can handle cameras with up to 200 MP sensors, natively supports 2x lossless zoom and AI-powered noise reduction and HDR imaging.
Devices that use Dimensity 8100 will be able to deliver 120Hz refresh rates on their screens at up to WQHD+ resolution. The AI video quality enhancement technology can convert standard dynamic range (SDR) video into HDR video.
MediaTek also added the 6nm Dimensity 1300 to its 5G family. The Dimensity 1300 integrates an octa-core CPU with an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores, along with an Arm Mali-G77 GPU and MediaTek APU 3.0 to support the latest AI capabilities.
The Dimensity 1300’s HDR-ISP supports up to 200MP, and integrates MediaTek’s HyperEngine 5.0 to offer an optimal balance between performance and power for better efficiency in gaming and daily use applications. It comes with new AI enhancements, improving night shot photography and HDR capabilities for better image clarity.