Xiaomi Officially Launches Future-Oriented “Loop Liquidcool Technology,” Mass Production Planned for H2 2022
Lei Jun, Founder, Chairman and CEO of Xiaomi, announced in a domestic social media post on Friday that the leading Chinese electronics firm has officially launched a future-oriented heat dissipation solution dubbed “loop liquidcool technology.” Its official poster shows that the technology was first launched by a custom Xiaomi MIX 4 Magic.
Lei said that the loop liquidcool technology refers to space satellites’ cooling solutions that pump a liquid cooling agent to the heat source of smartphones, where it then vaporizes and makes the heat conduct at high speed through a gas-liquid phase change, forming a smooth, closed looped channel. It has twice the cooling capabilities of VC, and is by far the strongest passive heat dissipation system of smartphones. The technology’s mass production will be carried out in the second half of 2022.
According to the introduction, an annular heat pipe system is composed of an evaporator, a condenser, a refill chamber, as well as gas and liquid pipes. Placed at the heat source area of the smartphone’s motherboard, the evaporator has a refrigerant that evaporates to gas when the smartphone’s processor is under high workload. The gas driven by the natural expansion of evaporation goes into the steam pipeline and is then diffused to the condenser, where the gas condenses into liquid again. These liquids are absorbed into pipes due to capillary force, and then are collected in the refill chamber – which refills the evaporator – making it a self-sustaining system.
SEE ALSO: Xiaomi CEO Lei Jun: Vehicles to Begin Mass Production in First Half of 2024
Lei also pointed out that although the principle of phase change is the same as that of VC liquid cooling, the actual effect is quite different due to differences in the structures. As conventional VC systems do not have separate channels for gases and liquids, hot gas moving to condenser and cool liquids moving towards evaporator mix and obstruct each other, especially when under a high workload. At the same time, the ring-shaped pump features a special gas pipe design, which greatly reduces air passage resistance by 30%. The steam flow is smoother, allowing heat to be directed over long distances to the cold end and the maximum heat transfer capacity is increased by up to 100%.
In terms of actual measurement, the firm used a custom Xiaomi MIX 4, and its original vapor chamber was replaced with a new loop liquidcool technology solution. During a 30-minute Genshin Impact gameplay test running 60fps max video settings, this impressive cooling system kept the device below a maximum temperature of 47.7℃, which is 5 ℃ lower than that of the ordinary Snapdragon 888 smartphone, and it even had a better frame rate heating performance than the game smartphone.