Chinese smartphone maker vivo on November 10 released the second generation of its self-developed V2 imaging chip, and introduced in-depth cooperation with MediaTek involving the use of its Dimensity 9200 chip.
During its annual developers conference on November 8, Chinese smartphone maker vivo unveiled its Android 13-based OriginOS 3, which commenced internal testing on November 9.
On the afternoon of October 24, Chinese smartphone manufacturer vivo held an imaging strategy conference. It unveiled a new self-developed imaging chip, although the name has not yet been announced.
Chinese smartphone brand vivo will commence an Imaging Strategy Conference at 14:00 on October 24, Beijing Time, during which it will bring forward a new generation of flagship imaging products.
Zeiss, a leading enterprise in the fields of optics and optoelectronics, on October 18 started construction of a new R&D and production base in Suzhou, Jiangsu Province, China.
Chinese smartphone maker vivo's latest foldable model, X Fold+, an upgraded version of the vivo X Fold that debuted in the first half of this year, launched in China on September 26.
On September 19, Jia Jingdong, Vice President of vivo, posted a work note for the vivo X Fold+ foldable smartphone on Chinese social media, offering several specific updates.
Vivo’s new foldable smartphone X Fold S is expected to be released in September. The new model may adopt the updated Qualcomm Snapdragon 8+ Gen 1 chipset made by TSMC, and will have a battery capacity of about 4700 mAh.
विवो का नया फोल्डेबल स्मार्टफोन एक्स फोल्ड एस सितंबर में जारी होने की उम्मीद है। नया मॉडल TSMC द्वारा निर्मित एक नए क्वालकॉम 8 + जनरल 1 चिपसेट का उपयोग कर सकता है, जिसमें लगभग 4,700 mA घंटे की बैटरी क्षमता होगी।
