NIO's first self-developed chip will be manufactured by Samsung, with the research and development team led by a former Huawei HiSilicon executive.
Chinese chip company SemiDrive recently launched an intelligent cockpit and parking integrated solution based on the high-performance automotive processor X9U.
BYD, a Chinese company specializing in new energy vehicles, announced the release of its "Yun Nian" System will be on April 10. The system is expected to integrate intelligent driving systems, cockpits and perception components, creating an innovative vehicle ecosystem.
Recently, Shanghai-based automotive acoustic solutions supplier ZAFEN completed a round A+ financing led by Beijing Xiaomi Zhizao Equity Investment Fund Partnership, an industrial investment fund under Xiaomi.
During this year's CES tech gathering in Las Vegas on January 3, Chinese electric vehicle giant BYD demonstrated its intelligent automotive cockpit equipped with US firm Nvidia's on-demand cloud gaming service, known as GeForce NOW.
Microsoft unveiled a total solution for the automotive and mobility sectors on August 28 at WNEVC.
Geely-backed auto parts supplier ECARX announced on August 5 that it has reached a strategic cooperation agreement with AMD, an American semiconductor company.
The new HI version of the Arcfox Alpha S electric vehicle model, jointly developed by Arcfox and Huawei, officially started batch delivery on July 16.